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AMD Sempron 250 - SD250XOKA23HL information

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Type:CPU Manufacturer:AMD
family:Bulldozer microprocessors:Sempron X2
Type CPU / Microprocessor
Market segment Desktop
Family
AMD Sempron X2
Model number    250
CPU part number
  • SD250XOKA23HL is an OEM/tray microprocessor
Frequency    3200 MHz
Turbo frequency 3*00 MHz
Package *04-pin organic lidded micro Pin Grid Array (UOF*04)
Socket Socket FM2
Size 1.5*" x 1.5*" / 4cm x 4cm
Weight 1.4oz / 3*g
Architecture / Microarchitecture
Microarchitecture Piledriver
Processor core    Richland
Core stepping    RL-A1
CPUID *10F31
Manufacturing process 0.032 micron
Data width *4 bit
The number of CPU cores 2
The number of threads 2
Floating Point Unit Integrated
Level 1 cache size    *4 KB shared instruction caches
2 x 1* KB data caches
Level 2 cache size    1 MB 1*-way set associative shared cache
Level 3 cache size None
Multiprocessing Uniprocessor
Features
  • MMX instructions
  • Extensions to MMX
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4   
  • SSE4a   
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • BMI1 / Bit Manipulation instructions 1
  • F1*C / 1*-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • FMA4 / 4-operand Fused Multiply-Add instructions
  • TBM / Trailing Bit Manipulation instructions
  • XOP / eXtended Operations instructions
  • AMD*4 / AMD *4-bit technology   
  • AMD-V / AMD Virtualization technology
  • EVP / Enhanced Virus Protection   
  • Turbo Core 3.0 technology
Low power features PowerNow!
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3
Other peripherals
  • PCI Express 2.0
  • Unified Video Decoder 3.2   
Electrical / Thermal parameters
Thermal Design Power    *5 Watt


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